Board connectors for all soldering technologies: THT – SMD – THR
The common connectors for the wave technology do not need special high-temperature resistant insulating bodies. A temperature resistance of approx. 180 °C is sufficient for a short-term temperature load.
With the introduction of SMD-solderable devices a temperature of at least 260-290 °C for approx. one minute is the prerequisite for using plastics in insulating bodies. This includes the dimensional stability beside the form stability.
The combination of those two techniques leads to the “through-hole-reflow” soldering technology a few years ago. It combines the advantages of the THT- and the SMD soldering technique, namely the mechanical strength of the THT soldering technique and the automation options of the SMD soldering technique. However, prerequisite is the high temperature resistance of the insulating body.
Early on and little by little company Fischer Elektronik changed the material of the insulating body of the connectors in general to high temperature resistant plastics for all types with introducing devices for the SMD soldering technology; independently of the use as a wave or SMD soldering device.
This circumstance already had a positive impact while introducing lead-free solders which usually affect a higher soldering temperature as well as the “THR” soldering technique did a few years ago.
Currently the shrinking grids demand highly fluid plastics which can be realised by the LCP types.
The product specialists at Fischer Elektronik www.fischerelektronik.de will be happy to assist you with any queries you may have or any additional information you require.