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Heatsinks for PGA
ICK PGA 6 x 6 x 14

Variants:

(ICKPGA6x6x14)


14 x 14 x 14 mm, for IC design PGA and others

add to request
ick_pga.tif
Features
way of fixation
  • therm. cond. adhesive
  • therm. conductive foil
socket
universal
suitable for processor type
universal
width
14 mm
height
14 mm
plate thickness
2.5 mm
length
14 mm
thermal resistance Rth
20 - 8 K/W
dissipation loss Pv
6.4 W
surface
black anodised